The international show Emballage and The Dieline launch a new packaging design event: “The Dieline Summit - The Peak of Package”, which will be held on November 16 and 17, 2014.
The event will consist in a European edition of the event organised in the USA by Andrew Gibbs, the founder of thedieline.com
The Dieline Summit will focus on rethinking the future of package design, and will be an innovation summit that gathers the leaders of the package design industry to discuss the issues that designers, consumers, and the world are facing. The summit will take place the 16th and 17th of November 2014, including an evening networking party, aimed at helping EMEA professionals to gain recognition and respect by articulating what design means to their brand, and their expanding role as package designers in this day and age.
“After our first collaboration showing The Dieline Awards winners at Emballage, we are delighted to host Andrew Gibbs’ The Dieline Conference in Paris this year. Indeed, our agreement with TheDieline.com will contribute to reinforce our 2014 Emballage’s motto ‘The capital place for packaging innovation’. And working with Andrew Gibbs, as a young and talented American designer, remains a very good opportunity to better understand the sector trends, our tomorrow clients’ needs,” highlighted Véronique Sestrières, Emballage & Manutention Shows Director
